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INTEGRATED CIRCUITS
DATA SHEET
TDA8754 Triple high speed ADC for LCD drive
Objective specification File under Integrated Circuits, IC02 1998 Sep 30
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
FEATURES * Triple 8-bit Analog-to-Digital Converter (ADC) * Sampling rate up to 170 MHz * IC controllable via a serial interface, which can be either I2C-bus or 3-wire, selected via a TTL input pin * IC analog input 0.5 to 1.1 V (peak-to-peak value) to have full-scale ADC input * Clamps for programming a clamp level through a clamping code between -63 and +64 by steps of 1 LSB * Controllable gain stages: gain controlled independently on the 3 channels via the serial interface to have a full-scale resolution to 1% * Low gain variation at different temperatures * Analog bandwidth of 400 MHz * Controllable PLL via the serial interface generates the ADC clock. It can be locked on line frequencies from 15 kHz up to 280 kHz. * Integrated PLL divider * Integrated clamp pulse and H and V LCD control pulses generation (independently adjustable in position and duration). Also a data enable signal can be generated, independently adjustable in position and duration with respect to HSYNC. * The pixel clock is available at half the clock frequency * Programmable phase clock adjustment cells * Internal voltage regulators * TTL compatible digital inputs * 3.3 V CMOS compatible digital outputs * Outputs: one port output up to 140 MHz or 2-port demultiplexed outputs on the full speed range. Operating mode selectable through the serial interface. * Chip enable: high-impedance ADC output * Power-down mode. ORDERING INFORMATION TYPE NUMBER TDA8754H PACKAGE NAME LQFP144 DESCRIPTION plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm GENERAL DESCRIPTION
TDA8754
The TDA8754 is a triple 8-bit ADC with controllable gain and clamps for the digitizing of large bandwidth R, G, B signals. Clamp level, gain, and all the other settings are controlled via a serial interface (either I2C-bus or 3-wire, selected through a logic input). The gain is optimized for stability versus temperature variations. The IC also includes a PLL that generates the ADC clock which can be locked to the horizontal line frequency. The PLL jitter is minimized for high resolution PC graphics applications. An external clock can also be used to clock the ADC. The clamp pulse is generated on-chip, it can be adjusted in position (with respect to HSYNC) and duration through the serial interface. The horizontal and vertical control pulses for the LCD can be adjusted in duration through the serial interface. Also a data enable signal can be generated, independently adjustable in position (with respect to HSYNC) and duration through the serial interface. Outputs: one port output up to 140 MHz or demultiplexed 2-port outputs on the full speed range. Operating mode selectable through the serial interface.
VERSION SOT486-1
1998 Sep 30
2
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
QUICK REFERENCE DATA SYMBOL VCCA VDD VCCD VCC(O) VCCA(PLL) VCC(O)(PLL) ICCA IDD ICCD ICC(O) ICCA(PLL) ICC(O)(PLL) INL DNL Gamp tset PARAMETER analog supply voltage for R, G, B channels logic supply voltage for I2C-bus and 3-wire interface digital supply voltage output stages supply voltage for R, G, B channels analog PLL supply voltage output PLL supply voltage analog supply current for R, G, B channels logic supply current for I2C-bus and 3-wire interface digital supply current output stages supply current for R, G, B channels analog PLL supply current output PLL supply current DC integral non-linearity DC differential non-linearity gain stability versus temperature setting time of the block ADC + AGC Vref = 2.5 V with 100 ppm/K variation input signal setting time <1 ns; setting to 1%; fi = 85 MHz CONDITIONS MIN. 4.75 3.0 4.75 3.0 4.75 4.75 - - - - - - - - - - TYP. 5.0 5.0 5.0 3.3 5.0 5.0 tbf tbf tbf tbf tbf tbf 1 0.5 - 2.5
TDA8754
MAX. 5.25 5.25 5.25 3.6 5.25 5.25 - - - - - - 1.5 0.8 200 3.5
UNIT V V V V V V mA mA mA mA mA mA LSB LSB ppm/K ns
fclk(max) fref fPLL jPLL(rms) D/DPLL Ptot
maximum conversion rate PLL reference clock frequency output clock frequency maximum PLL phase jitter (RMS value) PLL divider ratio total power consumption fclk = 170 MHz; ramp input
170 15 12 - 512 -
- - - 0.2 - tbf
- 120 170 - 4095 1.2
MHz kHz MHz ns
W
1998 Sep 30
3
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
BLOCK DIAGRAM
TDA8754
handbook, full pagewidth
RBOT
CLAMP RIN RDEC MUX ADC Vref RGAINC GGAINC 9 GIN GREEN CHANNEL GDEC 8 GBOT GA0 to GA7 and GOR GB0 to GB7 OEN CLP BGAINC 9 BIN BLUE CHANNEL BDEC 8 BCLP BBOT BA0 to BA7 and BOR BB0 to BB7 CKADCO CKBO CKAO DEN OUTPUTS 8 RB0 to RB7 RED CHANNEL 9 RA0 to RA7 and ROR
TDA8754
SEN SCL SDA I2C-3W SERIAL INTERFACE I2C-BUS AND 3-WIRE
CLP PLL
I2C:1-bit (Hlevel) VSYNC CKEXT CZ CP HSYNCO VSYNCO
REGULATOR
I2C:1-bit (Hlevel) HSYNC
DEC1 DEC2
PWOFF CKA/2, CKA/2
FCE045
Fig.1 Block diagram.
1998 Sep 30
4
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
PACKAGE OUTLINE LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
TDA8754
SOT486-1
c
y X
A 108 109 73 72 ZE
e
E HE
A A2
A1
(A 3) Lp L detail X
wM bp pin 1 index 144 1 wM D HD ZD B vM B 36 bp vM A 37
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 20.1 19.9 E (1) 20.1 19.9 e 0.50 HD HE L 1.0 Lp 0.75 0.45 v 0.2 w 0.1 y 0.1 Z D(1) Z E(1) 1.40 1.10 1.40 1.10 7 0o
o
22.15 22.15 21.85 21.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT486-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-08-04
1998 Sep 30
5
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all LQFP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 50 and 300 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. Wave soldering Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. CAUTION Wave soldering is NOT applicable for all LQFP packages with a pitch (e) equal or less than 0.5 mm.
TDA8754
If wave soldering cannot be avoided, for LQFP packages with a pitch (e) larger than 0.5 mm, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Sep 30
6
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8754
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1998 Sep 30
7
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545104/750/01/pp8
Date of release: 1998 Sep 30
Document order number:
9397 750 04134

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